XP Bond is now called Prime&Bond XP – a new name for reliability

Article

XP Bond® is now called Prime&Bond® XP – A new name for reliability. Over twenty years ago, Dentsply Sirona launched the first one bottle adhesive: Prime&Bond® in the US. Next generations were known as Prime&Bond® 2.0 and Prime&Bond® 2.1. The most recent family member, the high-performance dental adhesive formerly known as XP Bond, is now being integrated into the Prime&Bond umbrella brand as Prime&Bond XP.

Over 20 years ago, Dentsply Sirona launched the first one bottle adhesive: Prime&Bond® in the US. Next generations were known as Prime&Bond® 2.0 and Prime&Bond® 2.1. With more than one billion applications and counting, its successor Prime&Bond® NT™ has been an integral part of restorative procedures for almost 2 decades. The most recent family member, the high-performance dental adhesive formerly known as XP Bond, is now being integrated into the Prime&Bond umbrella brand as Prime&Bond XP.

All of the product’s favorable properties will remain fully intact: there will be no changes either to its technology or to its chemistry. Only the name will be changed in order to show practitioners that this adhesive, too, stands for unrivaled Etch&Rinse excellence. Prime&Bond XP-formerly XP Bond-achieves great adhesion values and excellent marginal integrity both with light-curing composites and together with the Self Cure Activator also with dual- or self-curing composite cements, making it suitable for all direct and indirect restorations.

When Prime&Bond XP is used in conjunction with the Self Cure Activator (SCA) and a Dentsply Sirona cement such as Calibra® Ceram or Calibra® Automix, it can be used entirely without the light-curing step. This means that the fit of the restoration remains undisturbed and unaffected by a previously cured adhesive layer.

This universal applicability has also been confirmed by an in-vitro comparative study1 under the direction of Professor Roland Frankenberger of the University of Marburg. Prime&Bond XP-then still under the name of XP Bond-provided excellent marginal integrity for ceramic inlays even without light-curing.

Prime&Bond XP is described as a reliable partner for all direct and indirect restorations. This high-performance Etch&Rinse adhesive, formerly known as XP Bond, is now being integrated into the family of Dentsply Sirona Prime&Bond adhesives.

References

1. Frankenberger R; (2007) Marginal quality of self-etch and etch-and-rinse adhesives versus self-etch cements; Dent Mat; doi: 10.1016/j.dental.2007.04.003 (available from DENTSPLY on request).

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